Revolutionizing Semiconductor Packaging with Flexible Innovation
Microelectronics Assembly Technologies (MAT) delivers next-generation modular packaging that overcomes size, power, and reliability barriers — setting new standards for semiconductor performance.
Pioneering Modular Packaging
Founded by semiconductor industry innovators, MAT was established to advance a new approach to microelectronics assembly. Our technology replaces traditional rigid circuit boards with flexible film-based packaging that enhances thermal performance, increases density, and reduces manufacturing costs.
The Core Flex Advantage
Smaller. Faster. Cooler. Smarter.
MAT’s patented Core Flex Technology enables integrated circuits to move directly from wafer to module — bypassing intermediate packaging steps. By combining flexible circuits with integrated heat spreaders, MAT modules achieve:
- Up to 70% thickness reduction
- 50–100% increase in density
- Enhanced thermal dissipation and reliability
Proven Innovation
27 Patents. Decades of Experience. One Vision.
Our patented advancements in flexible circuitry, bifurcated module design, and compression interconnects redefine what’s possible in semiconductor assembly.
Our leadership team includes inventors behind industry milestones such as the original SIMM and DIMM memory modules — technologies that transformed modern computing. Read more about our patents.
Collaborate with the Experts
Contact us to discuss licensing opportunities, design collaboration, or technical consulting.